P-020

Aldona Jagminienė

aldona.jagminiene@ftmc.lt

Ina Stankevičienė, Jūratė Vaičiūnienė,  Giedrius Stalnionis, Vidas Pakštas, Eugenijus Norkus

Center for Physical Sciences and Technology (FTMC), Lithuania 

Electroless deposition of Cu-Zn alloys using  Co(II)–ethylenediamine complex  as reducing agent

Cu-Zn coatings are of significant interest due to their high strength, favorable plasticity and excellent mechanical properties. This versatile alloy is widely used in the development of advanced materials that require specific mechanical, chemical and physical properties.

The reduction of Cu-Zn by the Co(II)-ethylenediamine complex is influenced by factors such as pH, ethylenediamine concentration and temperature. It was observed that Cu-Zn films could be deposited on the surface of a roughened glass substrate which was first sensitized in SnCl₂ and then activated in PdCl₂ solutions.

Moreover, degassing and bubbling the plating solution with argon are critical to the process. Argon is used to remove oxygen from the solution preventing the oxidation of Co²⁺ which is necessary for its reduction by Cu²⁺. The plating rate up to 1µm  per 10 min was observed at room temperature. The composition of electrolessly deposited brass varied from 0 to 3%(weith).

Acknowledgement: this project has received funding from the Research Council of Lithuania (LMTLT), agreement No S-MIP-24-13.