P-019

Ina Stankevičienė

ina.stankeviciene@ftmc.lt

Aldona Jagminienė, Jūratė Vaičiūnienė,  Giedrius Stalnionis, Eugenijus Norkus

Center for Physical Sciences and Technology (FTMC), Lithuania

Electroless Plating Of Cu-Sn Alloys From Non-Aqueous Solutions Using TiCl3 As Reducing Agent

The electroless deposition of Cu-Sn alloys using the Ti3+/Ti4+ redox couple offers a wide range of practical applications across diverse industries including electronics, catalysts and corrosion-resistant coatings. The unique properties of electroless Cu-Sn such as uniformity, mechanical strength and excellent solderability make it an attractive option for advanced manufacturing. Ongoing research focused on optimizing electroless Cu-Sn deposition processes continues to drive its adoption in emerging applications positioning it as a crucial technology in the advancement of materials science and industrial innovation.

Electroless plating was carried out in a 95% ethanol solution. Due to the hydrolysis of tin(II) in aqueous solutions non-aqueous alcohol-based solutions were successfully employed to avoid this issue. The influence of solution composition and temperature was examined and the results are presented. The plating rate up to 0.25 µm per 10 minutes was observed at room temperature. The composition of the electrolessly deposited bronze varied from 5% to 25% of tin.

Acknowledgement: This project has received funding from the Research Council of Lithuania (LMTLT), agreement No S-MIP-24-13.